天然气化工,新材料,石油炼制,石油化工,精细化工,生物医药

功能有机新材料的合成及应用、过渡金属催化下的有机合成反应方法学、清净有机合成方法学、不对称催化及其在有机合成中的应用

摩擦学性能;润滑剂;离子液体;锂离子液体;电化学;淫羊藿苷;改革思路;硬脂酸钾薄膜;波谱分析;实验教学

Cyclization;Palladium-catalyzed;Palladium;Trifluoromethylation;Allenes;Transition Metal Catalysis;Synthesis;Ionic Liquids;Cycloisomerization;Heterocycles

1.Bo-Sheng Zhang, Yuke Li, Zhe Zhang, Yang An, Yu-Hua Wen, Xue-Ya Gou, Si-Qi Quan, Xin-Gang Wang, and Yong-Min Liang*. Synthesis of C4-Aminated Indoles via a Catellani and Retro-Diels− Alder Strategy.  J. Am. Chem. Soc., 2019, 141, 9731−9738.
2.Xin-Gang Wang, Yuke Li, Hong-Chao Liu, Bo-Sheng Zhang, Xue-Ya Gou, Qiang Wang, Jun-Wei Ma, and Yong-Min Liang*. Three-Component Ruthenium-Catalyzed Direct Meta-Selective C−H Activation of Arenes: A New Approach to the Alkylarylation of Alkenes. J. Am. Chem. Soc., 2019, 141, 13914−13922.
3.Xin-Hua Hao, Zi-Hang Qiu, Fan Yang, Xiao-Biao Yan, Qiang Wang, Xiang-Jun Gong, Xue-Yuan Liu,* Yong-Min Liang*. Copper-Catalyzed One-Pot Trifluoromethylation/Aryl Migration/ Carbonyl Formation with Homopropargylic Alcohols. Angew. Chem. Int. Ed. 2014, 53, 7629−7633.
4.Bo-Sheng Zhang, Yuke Li, Yang An, Zhe Zhang, Ce Liu, Xin-Gang Wang, and Yong-Min Liang*. Carboxylate Ligand-Exchanged Amination/C(sp3)−H Arylation Reaction via Pd/ Norbornene Cooperative Catalysis. ACS Catal., 2018, 8, 11827−11833.
5.Ping-Xin Zhou, Yu-Ying Ye, Ce Liu, Lian-Biao Zhao, Jian-Ye Hou, Dao-Qian Chen, Qian Tang, An-Qi Wang, Jie-Yu Zhang, Qi-Xing Huang, Peng-Fei Xu*, and Yong-Min Liang*. Palladium-Catalyzed Acylation/Alkenylation of Aryl Iodide: A Domino Approach Based on the Catellani-Lautens Reaction. ACS Catal., 2015, 5, 4927−4931.
6.Bo-Sheng Zhang, Lu-Yao Gao, Zhe Zhang, Yu-Hua Wen and Yong-Min Liang*. Three-component difluoroalkylation and trifluoromethylthiolation/ trifluoromethylselenolation of p-bonds. Chem. Commun., 2018, 54, 1185−1188.
7.Ce Liu, Yujie Liang, Nian Zheng, Bo-Sheng Zhang, Yuan Feng, Siwei Bi*and Yong-Min Liang*. Synthesis of indolines via a palladium/norbornene-catalyzed reaction of aziridines with aryl iodides.  Chem. Commun., 2018, 54, 3407-3410.

1. Synthesis of Naphthalenyl Acetate by Platinum-Catalyzed [1,5]-Sigmatropic Hydrogen Shift of Propargylic Esters.Chem Eur. J. 2008, 14, 10556
2. Au-Catalyzed Tandem Cyclization,[1,2]-Alkyl Migration Reaction of Epoxy Alkynes, Synthesis of Spiropyranones. Chem Eur. J. 2008, 14, 5282
3. Tandem Gold(III)-Catalyzed Amination-Intramolecular Hydroamination Reactions of 1-En-4-yn-3-ols with Sulfonamides, Efficient Approach to Highly Substituted Pyrroles. Adv. Synth. and Catal. 2008, 350, 243
4. Synthesis of Difurylmethane Derivatives via the Gold-Catalyzed Tandem Cycloisomerization,Dimerization of Epoxide Alkynes.Adv. Synth. and Catal. 2008, 350, 1275
5. PtCl2-Catalyzed Tandem Triple Migration Reaction toward (Z)-1,5-Dien-2-yl Esters. Org. Lett. 2008, 10, 3919

1. Semiconductor package for use in power supply module, has chip interconnect component further comprises an insulating material for filling a gap of the electrically conductive frame between the first chip and the second chip.
LIANG Y; QIU J; CHEN Q; LIANG L; CHEN J; LIANG Y M
公开日期: 2024-06-20 申请日期: 2023-12-07 公开号: US2024203843A1

2. Semiconductor package for use in power supply module, has chip interconnect component further comprises an insulating material for filling a gap of the electrically conductive frame between the first chip and the second chip.
LIANG Y; QIU J; CHEN Q; LIANG L; CHEN J; LIANG Y M
公开日期: 2024-06-14 申请日期: 2022-12-15 公开号: CN221149993U

3. Foam diffusion plate for use in e.g. liquid crystal display, has foam core layer whose upper and lower surfaces are covered with protective layer, where cells are formed inside core layer.
CHENG J H; WANG X L; LIANG M Y; HE X L
公开日期: 2023-11-01 申请日期: 2022-04-18 公开号: TW202342612A

4. Quantum dot diffusion plate for use in e.g. LCD, has quantum dot layer whose upper surface and lower surface are covered with protective layer, where mass percentage of raw material of layer is in specific range.
CHENG J H; WANG X L; LIANG M Y; HE X L
公开日期: 2023-07-21 申请日期: 2022-04-18 公开号: TW809826B1

5. 一种潮湿环境下墓葬壁画颜料层修复加固材料及其制备方法和应用
兰州大学
刘雪原; 梁永民
公开日期: 2023-06-13 申请日期: 2023-01-05 公开号: CN116253828A

6. Semiconductor package for use in electronic device, has substrate assembly comprising first surface and second surface opposite to first surface, where one of first and third surfaces includes stepped pattern to match surface of chips.
LIU Q; LIANG Y M; DING F; TIZIANI R; LIANG Y
公开日期: 2023-05-04 申请日期: 2022-10-27 公开号: US2023135498A1

7. Method for supporting the block coding, involves determining an arrangement position of a coding block selected by a user based on an arrangement order for each sentence component specified from a sentence structure.
LIANG Y M; LEE K Y; YONG S H; YANG Y M; NONG S; LI G; LIANG Y
公开日期: 2022-02-04 申请日期: 2020-07-24 公开号: KR2022013264A

8. Method for supporting the block coding, involves determining an arrangement position of a coding block selected by a user based on an arrangement order for each sentence component specified from a sentence structure.
YONG S H; YANG Y M; NONG S; LI G; LIANG Y; LIANG Y M; LEE K Y
公开日期: 2022-01-27 申请日期: 2021-07-07 公开号: WO2022019533A1

9. Semiconductor package for electronic device, has molding compound that encapsulates bare semiconductor chip, packaged semiconductor chip and underfill, where surface of bare semiconductor chip is exposed by molding compound.
LIU C; LEE C; WU J Y; HOU H; LIN H; CHENG J W; WANG T; LIANG Y; CHOU L; LI J; WU J; ZHENG R; WANG Z; ZOU L; LIU C S
公开日期: 2020-10-21 申请日期: 2018-09-28 公开号: TW708355B1

10. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2020-05-11 申请日期: 2018-04-19 公开号: KR2108236B1

11. Semiconductor package for electronic device, has molding compound that encapsulates bare semiconductor chip, packaged semiconductor chip and underfill, where surface of bare semiconductor chip is exposed by molding compound.
LIU C; LEE C; WU J Y; HOU H; LIN H; CHENG J W; WANG T; LIANG Y; CHOU L; LI J; WU J; ZHENG R; WANG Z; ZOU L; LIU C S
公开日期: 2020-03-26 申请日期: 2018-09-20 公开号: KR2093303B1

12. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2020-01-21 申请日期: 2018-07-10 公开号: TW683410B1

13. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
LEE C H; LI J; LIANG Y M; ZHENG R; YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; YOU J; CHENG J
公开日期: 2020-01-02 申请日期: 2019-09-13 公开号: US2020006171A1

14. Interference overload indication generator for communication system for uplink frequency division multiplexing transmission, generates interference overload indication based on interference overload state code.
DING M; LIANG Y; CHEN C; HUANG L; YANG Y M; LIANG Y M; LIU R M; MING D; RENMAO R; LIU R; YONGMING R
公开日期: 2019-09-24 申请日期: 2009-03-19 公开号: BR200909792A2

15. 一种4-氨基吲哚的合成方法
兰州大学
张博生; 梁永民
公开日期: 2019-08-23 申请日期: 2019-04-17 公开号: CN110156657A

16. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2019-06-16 申请日期: 2018-07-10 公开号: TW201924014A

17. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2019-05-23 申请日期: 2018-04-19 公开号: KR2019055692A

18. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2019-05-21 申请日期: 2018-06-28 公开号: CN109786268A

19. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2019-05-16 申请日期: 2018-02-28 公开号: US2019148250A1

20. Method for manufacturing semiconductor package for e.g. transistor, involves forming metallization structure on polymer material, where structure electrically connects die connector with conductive feature at outside semiconductor die.
YU C; CHEN H; LIANG Y; CHENG J W; LEE C; YU C Y; CHEN H M; LIANG Y M; LEE C H; YOU J; ZHENG R; LI J; CHENG J
公开日期: 2019-05-16 申请日期: 2018-03-11 公开号: DE102018105554A1

1. 离子液体接枝手性催化剂及其不对称催化反应研究
立项时间: 2006-2006 项目经费：80000

2. 建立兰州大学化学化工学院化学生物学实验平台
立项时间: 2011-2012 项目经费：1200000

3. 金铂催化重排、C-H活化/环化及转移金属化反应
立项时间: 2011-2013 项目经费：360000

4. 兰州大学化学基地
立项时间: 2012-2015 项目经费：4000000

5. 兰州大学化学基地
立项时间: 2007-2009 项目经费：1200000

6. 二取代磷基硅烷的反应性能和在有机合成中的应用研究
立项时间: 2002-2004 项目经费：190000

7. 重氮化合物亲核偶联试剂参与Catellani-Lautens反应研究
立项时间: 2015-2018 项目经费：900000

8. 过渡金属催化的新型串联环化反应设计研究及应用
立项时间: 2016-2020 项目经费：2900000

9. 钯催化羧酸酯与重氮化合物的脱羧插入反应构筑季碳研究
立项时间: 2013-2016 项目经费：800000

10. 过渡金属催化的串联C-H活化/环化反应设计
立项时间: 2009-2011 项目经费：380000

11. 兰州大学化学基地
立项时间: 2008-2010 项目经费：2000000

12. 邻炔丁醇苯甲醛的亲电环化及缩醛反应合成大环聚醚反应探究
立项时间: 2018-2018

13. 钯/降冰片烯共催化下吲哚对氮杂环丙烷的开环反应
立项时间: 2018-2018

14. 基于不对称催化C(sp3)-H糖基化合成手性C-烷基糖苷的研究
立项时间: 2023

15. 过渡金属 催化糖苷类 化合物 的合成研究
立项时间: 2021

技术咨询