论文著作：
1. Hui Fang, Shicheng Zhou, Xiaoyun Qi, Chenxi Wang*, Yanhong Tian, “A Multifunctional Osteogenic System of Ultrasonically Spray Deposited Bone-Active Coatings on Plasma-Activated Magnesium”, Journal of Magnesium and Alloys. (accepted and in press) (IF=10.088)
2. Xiaoyun Qi, Shicheng Zhou, Hui Fang, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang*, “One-Step PDA Coating Strategy on Pure Zn for Blood-Contacting Engineering”, Journal of Materials Science & Technology, 123, 2022, pp. 78-91. (IF=8.067)
3. 王晨曦*, 戚晓芸，方慧，康秋实，周诗承，许继开，田艳红. 紫外光活化低温键合研究进展. 机械工程学报, Vol. 58, No. 2, 2022, pp. 122-135.
4. Hui Fang, Shicheng Zhou, Xiaoyun Qi, Yanhong Tian, Chenxi Wang*, “Hybrid Plasma Activation Strategy for the Protein-Coated Magnesium Implants in Orthopedic Applications, Advanced Materials Interfaces, 2022, 2101724. (IF=6.147，入选期刊封面图片)
5. Hui Fang, Xiaoyun Qi, Shicheng Zhou, Shuyan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang*, “High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-co-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent Applications”, ACS Applied Materials & Interfaces, 14, 2022, 3536-3550. (IF=9.229，入选期刊封面图片)
6. Hui Fang, Chenxi Wang*, Shicheng Zhou, Ge Li, Yanhong Tian, Tadatomo Suga, “Exploration of the Enhanced Performances for Silk Fibroin/Sodium Alginate Composite Coatings on Biodegradable Mg？Zn？Ca Alloy”, Journal of Magnesium and Alloys, 9, 2021, pp. 1578-1594. (IF=10.088)
7. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Ge Li, Tian Lu, Yanhong Tian, Peng He, “Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture”, ACS Applied Materials & Interfaces, 13, 2021, pp. 38866-38876. (IF=9.229，入选期刊封面图片，被HIT TIMES报道)
8. Hui Fang, Chenxi Wang*, Daoyuan Li, Shicheng Zhou, Yu Du, He Zhang, Chunjin Hang, Yanhong Tian, and Tadatomo Suga, “Fabrication of Ag@Ag2O-MnOx Composite Nanowires for High-Efficient Room-Temperature Removal of Formaldehyde”, Journal of Materials Science & Technology, 91, 2021, pp. 5-16. (IF=8.067)
9. Jikai Xu, Zhihao Ren, Bowei Dong, Xinmiao Liu, Chenxi Wang*, Yanhong Tian*, Chengkuo Lee*, “Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy”, ACS Nano, 14, 2020, pp. 12159-12172. (IF=14.588)
10. Chenxi Wang*, Hui Fang, Chunjin Hang, Yaru Sun, Zhibin Peng, Wei Wei, and Yansong Wang*, “Fabrication and Characterization of Silk Fibroin Coating on APTES Pretreated Mg-Zn-Ca Alloy”, Materials Science & Engineering C, 110, 2020, 110742. (IF=5.880)
11. Chenxi Wang*, Hui Fang, Shicheng Zhou, Xiaoyun Qi, Fanfan Niu, Wei Zhang, Yanhong Tian, and Tadatomo Suga, “Recycled Low-Temperature Direct Bonding of Si/Glass and Glass/Glass Chips for Detachable Micro/Nanofluidic Devices”, Journal of Materials Science & Technology, 46, 2020, pp. 156-167. (IF=6.155)
12. Hui Fang, Chenxi Wang*, Shicheng Zhou, Zhen Zheng, Tian Lu, Ge Li, Yanhong Tian, and Tadatomo Suga “Enhanced Adhesion and Anticorrosion of Silk Fibroin Coated Biodegradable Mg-Zn-Ca Alloy via a Two-Step Plasma Activation”, Corrosion Science, 168, 2020, 108466. (IF=6.479)
13. Jikai Xu, Chenxi Wang*, Xiaojiang Ji, Qi An, and Yanhong Tian*, and Tadatomo Suga, “Direct Bonding of High Dielectric Oxides for High-Performance Transistor Applications”, Scripta Materialia, 178, 2020, pp. 307-312. (IF=5.155)
14. Jikai Xu, Chenxi Wang*, Runbo Zhang, Ji Cheng, Ge Li, Junshan Xiang, and Yanhong Tian*, “VUV/O3 Activated Direct Heterogeneous Bonding towards High-Performance LiNbO3-Based Optical Devices”, Applied Surface Science, 495, 2019, 143576. (IF=6.182)
15. Chenxi Wang*, Hui Fang, Xiaoyun Qi, Chunjin Hang, Yaru Sun, Zhibin Peng, Wei Wei, and Yansong Wang*, “Silk Fibroin Film-Coated MgZnCa Alloy with Enhanced in Vitro and in Vivo Performance Prepared Using Surface Activation”, Acta Biomaterialia, 91, 2019, pp. 99-111. (IF=7.242)
16. Chenxi Wang*, Jikai Xu, Shu Guo, Qiushi Kang, Yuan Wang, Yiping Wang, and Yanhong Tian, “A Facile Method for Direct Bonding of Single-Crystalline SiC to Si, SiO2, and Glass Using VUV Irradiation”, Applied Surface Science, 471, 2019, pp. 196-204. (IF=6.182)
17. Jikai Xu, Chenxi Wang*, Yanhong Tian*, Bin Wu, Shang Wang, and He Zhang, “Glass-on-LiNbO3 Heterostructure Formed via a Two-Step Plasma Activated Low-Temperature Direct Bonding Method”, Applied Surface Science, 459, 2018, pp. 621-629. (IF=6.182)
18. Jikai Xu, Chenxi Wang*, Te Wang, Yannan Liu, and Yanhong Tian, “Direct Bonding of Silicon and Quartz Glass Using VUV/O3 Activation and a Multistep Low-Temperature Annealing Process”, Applied Surface Science, 453, 2018, pp. 416-422. (IF=6.182)
19. 王晨曦*, 王特, 许继开，田艳红. 晶圆直接键合及室温键合技术研究进展. 精密成形工程, Vol. 10, No. 1, 2018, pp. 67-73.
20. Chenxi Wang*, Yuan Wang, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Room-Temperature Direct Bonding of Silicon and Quartz Glass Wafers”, Applied Physics Letters, Vol. 110, 221602, 2017.
21. Chenxi Wang*, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 7, 2017, pp. P373-P378. (入选期刊封面图片)
22. Chenxi Wang*, Yannan Liu, and Tadatomo Suga, “A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 1, 2017, pp. P7-P13. (入选期刊封面图片)
23. Chenxi Wang*, and Tadatomo Suga, “Investigation of Fluorine Containing Plasma Activation for Room-Temperature Bonding of Si-based Materials”, Microelectronics Reliability, Vol. 52, No. 2, 2012, pp. 347-351. (邀请论文)
王晨曦
山东省
研究领域：
新材料
研究方向：
1. 芯片键合新技术
2. 晶圆键合关键技术与装备
3. 三维集成与封装
4. 精密焊接与微纳连接
5. 医用新材料连接
所在单位：
哈尔滨工业大学
